Engineering Research Recognized at International Conference
January 25, 2017
Congratulations to electrical and computer engineering assistant professor Ata Zadehgol and master's graduate student Venkatesh Avula on winning the "Best Poster Paper Award" at the 2016 Institute of Electrical and Electronics Engineers (IEEE) Electrical Design of Advanced Packaging & Systems (EDAPS) conference in Hawaii.
IEEE-EDAPS is the premier international conference in Asia‐Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels.
Their paper, titled "Coarse-to-fine Malleable Pole/Residue Equivalent System Solver (COMPRESS)," develops an improved methodology in system identification that results in more efficient modeling of advanced packages in microelectronics.
Professor Zadehgol leads the Applied Computational Electro Magnetics & Signal Power Integrity (ACEM-SPI) laboratory within the College of Engineering. ACEM-SPI is an interdisciplinary field, at the cross-roads of three disciplines: electromagnetic physics, computational science and mathematics/linear algebra with many important applications including but not limited to computer chip design, circuits and signal and power integrity, wireless communications, nano-devices, lasers and even stealth technology.
The award-winning research was supported by Micron Technology Inc., through a Micron Research Grant, in cooperation with Brent Keeth, Ph.D., Sr. Fellow at Micron Technology Inc.
Avula recently successfully defended his M.S. thesis electrical engineering and has accepted an offer to join Micron Technology Inc.
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